
PCA9665_2 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 7 December 2006 81 of 91
NXP Semiconductors
PCA9665
Fm+ parallel bus to I
2
C-bus controller
Fig 47. Package outline SOT360-1 (TSSOP20)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153
99-12-27
03-02-19
w M
b
p
D
Z
e
0.25
110
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
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