
PCA9665_2 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 7 December 2006 82 of 91
NXP Semiconductors
PCA9665
Fm+ parallel bus to I
2
C-bus controller
Fig 48. Package outline SOT662-1 (HVQFN20)
0.651
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
5.1
4.9
D
h
3.25
2.95
y
1
5.1
4.9
3.25
2.95
e
1
2.6
e
2
2.6
0.38
0.23
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT662-1 MO-220- - - - - -
0.75
0.50
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT662-1
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 5 x 5 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
610
20
16
15
11
5
1
X
D
E
C
B
A
e
2
terminal 1
index area
terminal 1
index area
01-08-08
02-10-22
AC
C
B
v
M
w
M
E
(1)
D
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
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